UNISOC‘s products include mobile communication CPU, baseband chips, AI chips, radio frequency front-end chips, radio frequency chips and other communication, computing and control chips. Its business scope includes four major areas of consumer electronics, industrial electronics, smart power electronics and ecological products, covering 128 countries around the world, and has passed the shipping certification of hundreds of operators around the world. In an exclusive interview with Jayanta Ghosh of DeviceNext, Mr. Eric Zhou (SVP of UNISOC) explained about UNISOC’s R&D centric investments and its latest 5G product series, Tanggula.
Company’s expansion plans
At UNISOC, we are expanding our product portfolio in 5G, IoT, and AI. We have several exciting projects already in the pipeline for 2022. There will be new product launches and market deployment of our recently launched offerings. For instance, we are currently shipping our fast selling chipsets -T610, and T618 to our partner brands to launch the latest technology products. We actively support the commercialisation of 5G technology and will be looking forward to creating a robust foundation for 5G and IoT connectivity in the whole world.
We are also making strategic R&D-centric investments to strengthen our product offerings and capitalise on the next wave of digitisation looming just over the horizon. Apart from the upcoming launches, we are also partnering with leading technology players to develop, deliver, and implement successful use-cases.
Plans for Indian Market
India presents a massive opportunity for growth in mobile and IoT sectors for leading global chipset manufacturers such as UNISOC. We have joined hands with multiple mobile manufacturing brands in India, like Motorola, Micromax, Realme, Lava, Reliance Jio to name a few. Furthermore, India has the most considerable number of smartphone consumers globally. Therefore, at UNISOC, we believe it is the right time to invest to drive the advancement of 5G and IoT. Our mantra has always been to provide high-end technology to people at an affordable price in partnership with leading technology brands. We are also working with our partners to introduce many smart devices to power intelligent, interconnected cities in India.
USP of recent launch
UNISOC T610 is a 4G smartphone processor focused on delivering users the ultimate smartphone experience. The chipset is based on a 12nm process with two 1.8 GHz Arm Cortex-A75 CPUs and six 1.8 GHz Arm Cortex-A55 CPUs, while the GPU uses the 614.4MHz Mali G52. The T610 chipset boosts single-core performance by 45% and multi-core performance by over 25% as opposed to products from other competing brands. UNISOC T610 chipset offers smartphone users optimum performance, enhanced energy efficiency, seamless gameplay, and picture-perfect photography.
Which phones will be having T610 chipset
In India, Realme and Micromax have already launched their phones on T610 and we have already collaborated with more mobile phone brands that are going to launch their phones with T610 chip in the coming months. Globally, many mobile phone brands like Honor, Hisense, and Teclast have launched their phones with T610 chipset.
In fact, smartphones with T610 have been very popular in China‘s 618 E-commerce festival (just second only to the Singles’ Day). In Southeast Asia, Realme C21Y with UNISOC T610 sold more than 10 million units in 3 months
How are you addressing the global shortage of components?
Today, chipsets are the heart of any innovation. Chipsets power everything – from phones to smart homes. However, at UNISOC, we recognise that the ongoing global shortage of chipsets is a significant challenge affecting innovation. Therefore, we only launch a project if and when we are confident that we’ll be able to meet the demands of our partners to a certain extent and can achieve business goals.
Also, different chipset fabrication models have different levels of shortages, so we try to offer our partners substitute chipsets to meet the demands only during dire need.
What are your 5G plans
We are working intensively to introduce 5G. Our UNISOC 5G Chips are aimed to enable an intelligent world contributing to the growth of new 5G infrastructure. We had recently released our 5G product series, Tanggula, which took us one step closer to achieve our vision of building an intelligent interconnected world.
UNISOC is the first company to have successfully completed the end-to-end service validation of the world’s first eMBB+uRLLC+IIoT (enhanced mobile broadband + ultra-reliable and low latency communications + industrial Internet of things) based on the 3GPP Release 16(R16) standard. It created the foundation for commercial launch of 5G R16. At UNISOC, we have also launched the Tanggula V516 platform, the industry’s first product platform supporting 5G R16.
Furthermore, we have already launched more than 100 commercial industry applications based on UNISOC 5G chips, thereby digitally transforming many industries like intelligent logistics, intelligent electricity, intelligent mining, intelligent transportation, and intelligent manufacturing.
